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[키워드: "Wei, Tok Chee"]

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  • 자료유형
    • Conference Materials(10)

  • 주제어
    • components, circuits, devices and systems(4)
    • wires(4)
    • bonding(3)
    • coatings(2)
    • gold(2)
    • insulation(2)
    • surface treatment(2)
    • adhesives(1)
    • aging(1)
    • atmosphere(1)
    • ball bonding(1)
    • bonding wire(1)
    • copper wire(1)
    • curing(1)
    • free air ball(1)
    • gold wire(1)
    • interfacial reaction(1)
    • metallization(1)
    • neck(1)
    • optimization(1)
    • photonics and electrooptics(1)
    • plating(1)
    • reliability(1)
    • silver(1)
    • silver wire(1)

  • 저널
    • 2014 ieee 16th electronics packaging technology conference (eptc)(2)
    • 2015 ieee 17th electronics packaging & technology conference (eptc)(2)
    • 2015 ieee 17th electronics packaging and technology conference (eptc), electronics packaging and technology conference (eptc), 2015 ieee 17th(2)
    • 2016 ieee 37th international electronics manufacturing technology (iemt) & 18th electronics materials & packaging (emap) conference(1)
    • 2016 ieee 37th international electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference, electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference, 2016 ieee 37th international(1)
    • 2017 ieee 19th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2017 ieee 19th(1)
    • 36th international electronics manufacturing technology conference(1)

  • 언어
    • english(10)

  • 수록DB
    • Complementary Index(6)
    • IEEE Xplore Digital Library(4)

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